Integrated circuit socket

专利摘要:
PURPOSE: An integrated circuit socket is provided to minimize the electrical connection length between a device contact and a PCB contact to improve electrical transmission characteristics. CONSTITUTION: A position fixing hole is formed in an elastomer(7) at the same X-Y position as that of a device contact(9), a spring(5) is inserted into the position fixing hole, and a socket pin(4) is inserted into the inside diameter of the spring to prevent the spring from being removed from the hole according to elastic force of the elastomer, thereby maintaining electrical contact of the socket pin and the device contact all the time. To minimize the electrical connection length between the socket pin and a socket PCB contact(11), the socket pin is inserted into the inside diameter of the spring and a conduit is set at the bottom of the spring to make the pitch of the spring 0mm.
公开号:KR20030035075A
申请号:KR1020010066948
申请日:2001-10-30
公开日:2003-05-09
发明作者:이영희
申请人:이영희；
IPC主号:

专利说明:

Integrated Circuit Sockets {INTEGRATED CIRCUIT SOCKET}
[11] In the integrated circuit socket (FIG. 1) of the present invention, a test process for electrically inspecting a circuit completeness of a device in a semiconductor manufacturing process and classifying it as good or defective and removing the initial defective product before shipment to increase the reliability of the device- It is a device mainly used in the phosphorus process and serves as a medium for making an electrical connection between the device contact 9 and the printed circuit board contact 11.
[12] The integrated circuit socket (FIG. 1) minimizes the length of the electrical connection between the device contact 9 and the printed circuit board contact 11, which have an absolute effect on the electrical transmission characteristics, while also continuously minimizing the socket pins with minimal space. Maintaining tension in 4) is the key technology.
[13] The conventional technique for maintaining the tension of the socket pin 4 is a method of bending the socket pin 4 in the form of "C" to take advantage of the elasticity of the socket pin 4 itself naturally occurring.
[14] This method requires the socket pin 4 to be bent in a “C” shape, so that the length of the socket pin 4 is about 15.0 mm to 30.0 mm, which is relatively longer than five times longer than the length of the vertical socket pin 4. Electrical transmission characteristics are degraded. In other words, the inductance increases in direct proportion to the length of the electrical connection path, which causes electrical transmission loss and distortion, which adversely affects the electrical transmission characteristics. Since the electrical characteristics of the integrated circuit socket (FIG. 1) are inversely proportional to the length of the socket pin 4, the length of the socket pin 4 should be as short as possible.
[15] Therefore, this structure has reached the current limit as a technology that is difficult to apply to the device 10 for testing the operation speed and the data transmission speed of 100 MHz or more due to the degradation of the electrical transmission characteristics.
[16] In addition, since the socket pin 4 is bent in the form of "C", the tension of the socket pin 4 itself, which occurs naturally, requires a lot of space for tension maintenance. Therefore, whether or not such a structure is applied depending on the package type is determined, it is a technology that is not applicable to the package (BGA: Ball Grid Array) type.
[17] Package trends are moving in the form of Chip Scale Package (CSP) and Fine Ball Grid Array (FBGA). The current technology is difficult to apply because of the limitation of pitch.
[18] Due to the development of semiconductor process and design technology, the operation speed of the device 10 is increasing very rapidly, and the package trend is changing to thin, light, and small micro and FB forms. For example, the current data transfer rate of Direct Rambus Dynamic Random Access Memory (DRDRAM), which is emerging as the next generation main memory, is 800Mbps (Megabits Per Sec), and in the future, 1.0Gbps (Gigabits Per). Increased above Sec), the package is a BB type, the pitch between the ball and the ball in four directions will be reduced to 0.5mm.
[19] Therefore, the technical problem to be achieved by the present invention is to make an integrated circuit socket (Fig. 1) that can be appropriately and actively cope with future technological development. In other words,
[20] Ⓛ minimizes the electrical connection length between the device contact 9 and the printed circuit board contact 11 to improve the electrical transmission characteristics,
[21] ② Minimize space due to maintaining tension of socket pin (4).
[1] 1 is a cross-sectional view of an integrated circuit socket
[2] 2 is a detailed view of the socket pin 4
[3] 3 is a detailed view of the spring 5
[4] 4 is a detailed view of the heater (7)
[5] Explanation of symbols on the main parts of the drawings
[6] (1) Contact part (2) Elastic conversion part (3) Connection part
[7] (4) Socket pin (5) Spring (5) (SPRING) (6) Conduit
[8] (7) ELASTOMER (8) Position fixing hole (9) Divas contact
[9] (10) DEVICE (11) Printed Circuit Board Contacts (12) Printed Circuit Board
[10] (13) fixing part
[22] In order to achieve the above object, the present invention provides a plurality of socket pins 4 having the same electrical characteristics and shapes, and the heaters 7 so that the positions of the socket pins 4 always coincide with the XY positions of the device contacts 9. In the same position as the device contact 9, and the spring 5 is inserted therein to prevent the spring 5 from being pulled out by the elastic force (shrinkage force) of the heater. And in order for the elasticity of the spring 5 to be converted into tension for continuous vertical movement of the socket pin 4, the elastic switching portion 2 having the cross-sectional area of a portion of the socket pin 4 larger than the inner diameter Φ of the spring 5. There is).
[23] In addition, when the electrical connection between the socket pin 4 and the socket printed circuit board contact 11 is made along the length of the spring 5, the electrical connection length becomes long. In order to solve this problem, the connecting portion 3 is inserted into the inner diameter Φ of the spring 5, and the pitch (interval) of the spring 5 is 0 mm at the lower end of the spring 5 where electrical contact is made. When the force of the contraction is connected to each other there is a conduit (6) which is connected to each other so that the electrical connection path is not made along the length of the spring (5) to make a vertical connection. And it is composed of the fixing portion 13 for maintaining the shape and the socket pin (4), each component and role are as follows.
[24] ① Socket pin (4)
[25] Socket pin (4) is composed of a plurality of the same shape and electrical characteristics, divided into contact portion (1), elastic switching portion (2), connecting portion (3), the material has good electrical transmission characteristics and good wear resistance characteristics The material is good. For example, alloys such as beryllium copper are preferred. Further, the surface of the socket pin 4 may be plated to prevent oxidation of the surface in the air and to improve conductivity. Although the thickness and size of the socket pin 4 may be slightly different depending on the specifications of the device 10 to be applied, the thickness is appropriately 0.1 to 1.0 mm, and the length is appropriately 1.0 to 4.0 mm.
[26] The function and role of each part of the socket pin 4 are as follows.
[27] end. Contact (1)
[28] It is a part that transmits an electrical signal into the device 10 while repeatedly making electrical contact with the device contact 9, and the contact resistance between the device contact 9 and the contact part 1 should be as small as possible. Increasing the contact resistance may cause an error in determining the normal device 10 as defective.
[29] Therefore, the shape of the pin and the elastic force of the spring 5 should be taken into consideration so as to reduce the contact resistance while minimizing the damage of the device contact 9. In order to prevent such an increase in contact resistance and to achieve more stable contact, the head of the contact part 1 may be M-shaped like a crown.
[30] I. Elastic switching part (2)
[31] Elastic conversion portion as a portion to make the cross-sectional area of a portion of the socket pin 4 larger than the size of the inner diameter Φ of the spring 5 so that the tension of the socket pin 4 is maintained by the elasticity of the spring 5, not its own elasticity. The size of (2) is preferably about 0.1 mm to 1.0 mm larger than the size of the inner diameter Φ of the spring 5 so that the elasticity can be stably switched in consideration of the pitch of the device 10.
[32] All. Connection part (3)
[33] In order to minimize the electrical connection between the socket pin 4 and the socket printed circuit board contact 11, when the electrical connection is made along the length of the spring 5, the electrical connection length is much longer than that of the straight line. In order to solve the problem, the thickness of the outer diameter Φ of the connecting portion 3 is greater than the inner diameter Φ of the spring 5 so that the connecting portion 3 is inserted into the inner diameter of the spring 5 and the electrical connection with the conduit portion 6 is always made. It is good to make it about 0.01-0.03 mm small.
[34] ② Spring (5)
[35] In order to continuously maintain the vertical movement of the socket pin 4, the elastic switching part 2 is caught by the spring 5 so that the elasticity of the spring 5 can be converted into the tension of the socket pin 4. This elasticity allows the socket pin 4 to continue vertical movement.
[36] Since the elasticity of the spring 5 directly affects the tension of the socket pin 4, the following should be considered. First, when the elastic force is low, a soft contact phenomenon occurs in which electrical contact resistance increases between the contact portion 1 of the socket pin 4 and the contact 9 of the device, which causes a serious problem in the device 10 test. Conversely, an increase in elasticity causes damage to the contacts 9 of the device.
[37] Therefore, the elasticity of the spring 5 must satisfy the conditions that can simultaneously minimize the electrical contact resistance and damage between the contact portion 1 and the contact 9 of the device. Therefore, as a result of the test, the elastic force of the spring 5 is appropriately about 10 g to 100 g when shrinking 0.2 to 0.3 mm.
[38] The material is suitable for spring (5) steel with excellent elasticity and durability, and it is better to plate for discoloration and conductivity improvement. It is suitable. In addition, heat resistance against temperature is also important, and the temperature range is -40 to 250 ° C.
[39] ③ Conduit part (6)
[40] The electrical connection between the socket pin 4 and the printed circuit board contact 11 is to be made to the minimum length, and the connecting part 3 is inserted into the inner diameter Φ of the spring 5 and the electrical contact with the end of the The conduit part 6 which makes the pitch (interval) of the spring 5 0 mm at the lower end part of the spring 5 which consists of these is provided.
[41] When the socket pin 4 and the device contact 9 make electrical contact, the spring 5 receives the contracting force, which causes the springs 5 to stick together in the conduit 6 so that the electrical connection path is the spring 5. The length of the electrical connection is minimized by allowing vertical connection passages to be made, rather than along the length of.
[42] ④ Position fixing hole (8)
[43] The position of the socket pin 4 is always matched with the X-Y position of the device contact 9 so that the electrical contact is made and prevents the spring 5 from being pulled out by the elastic force (shrinkage force) of the heater.
[44] For this purpose, a fixing hole 8 is formed at the same X-Y position as the contact 9 of the device in the heater 7 and a spring 5 is inserted into the hole 8. The spacing and position of the positioning holes 8 is determined by the specifications of the device 10 applied.
[45] The size of the position fixing hole 8 is slightly different depending on the specification of the application device 10, but it is about 0.01 to 0.1 mm smaller than the outer diameter Φ of the spring 5, so that the elastic force (shrinkage force) of the heater 7 is reduced. It is good to prevent the spring 5 from falling out.
[46] ⑤Government government (13)
[47] The protection of the socket pin 4 and the appearance of the integrated circuit socket (FIG. 1). The material of this part is good material such as high tensile, high strength engineering plastic. In addition, it should be electrically insulated and the temperature range is -40 ~ 250 ℃. And the shape of the appearance may vary depending on the intended application.
[48] According to the present invention, when the electrical contact between the device contact (9) and the socket pin (4) is made, at least the socket pin (4) can be moved vertically by the elasticity of the elastic switching unit (2) and the spring (5) Tension can be maintained in space to overcome the limitations of pitch. In addition, the length of the electrical connection between the device contact 9 and the printed circuit board contact 11 can be minimized by using the connection portion 3 and the conduit portion 6, thereby greatly improving the electrical transmission characteristics.
[49] Therefore, it can be applied to the test of the high-speed operation device 10, and can be applied to the integrated circuit socket (FIG. 1) that can overcome the limitation of the pitch according to the package type and can actively cope with the development of semiconductor manufacturing technology in the future. It is a skill.

权利要求:
Claims (6)
[1" claim-type="Currently amended] It is used in the test process for electrically inspecting the circuit completeness of the device during the semiconductor manufacturing process and classifying it as good or bad. The device contact point 9, that is, an electrical input / output terminal (LEAD) or An integrated circuit socket (FIG. 1) serving as a medium for making an electrical connection between a ball and a printed circuit board contact 11, in particular, an integrated circuit for repeatedly making an electrical connection with the device contact 9 In the socket (Fig. 1),
The tension retaining function, which is one of the core roles of the socket pin 4, is maintained by the elastic force of the elastic converter 2 and the spring 5 so that the socket pin 4 can maintain the vertical movement and thus the space according thereto. And minimizing the electrical connection length between the device contact 9 and the printed circuit board contact 11 using the connection part 3 and the conduit part 6.
In order to achieve the above object, the present invention provides a plurality of socket pins 4 having the same electrical characteristics and shapes, and socket pins (so as to maintain electrical contact between the socket pins 4 and the device contacts 9 at all times). In order to ensure that the position of 4) always coincides with the XY position of the device contact 9, the fixing hole 8 is formed in the heater 7 at the same XY position as the device contact 9, where the spring 5 And inserting the socket pin (4) in the spring inner diameter Φ to prevent the spring (5) is pulled out by the elastic force (shrinkage force) of the heater. In order to allow the elasticity of the spring 5 to be converted into tension for continuous vertical movement of the socket pin 4, the elastic switching part 2 having a cross-sectional area of a portion of the socket pin 4 larger than the inner diameter Φ of the spring 5. ).
In addition, in order to minimize the length of the electrical connection between the socket pin 4 and the socket printed circuit board contact 11, the socket pin 4 is inserted into the inner diameter Φ of the spring 5 and the spring is in electrical contact with the connecting portion 3 ( The conduit part 6 which makes the pitch (interval) of the spring 5 0 mm at the lower end part of 5) is provided. When the socket pin 4 and the device contact 9 make electrical contact, the spring 5 receives the contracting force, which causes the springs 5 to stick together in the conduit 6 so that the electrical connection path is the spring 5. The length of the electrical connection is minimized by allowing vertical connection passages to be made, rather than along the length of. And an integrated circuit socket (FIG. 1) consisting of fixing parts (13) for shape retention and protection of socket pins (4).
[2" claim-type="Currently amended] 2. The integrated circuit socket (1) according to claim 1, characterized in that it has an elastic converter (2) for maintaining the tension for the vertical movement of the socket pin (4) by the elastic force of the spring (5). ).
[3" claim-type="Currently amended] An integrated device according to claim 1, characterized in that it is provided with a connecting portion (3) and inserted into the inner diameter (Φ) of the spring (5) in order to minimize the electrical connection length between the printed circuit board contact (11) and the socket pin (4). Circuit socket (FIG. 1).
[4" claim-type="Currently amended] 2. The conduit section (6) according to claim 1, characterized in that it has a conduit (6) with a pitch (interval) of 0 mm at the bottom of the spring (5) which meets the connecting section (3) in order to minimize the electrical connection length. Integrated circuit socket (Fig. 1).
[5" claim-type="Currently amended] The method according to claim 1, wherein the position of the socket pin 4 is always matched to the XY position of the device contact 9 so that the electrical contact between the socket pin 4 and the device contact 9 is always maintained, An integrated circuit socket (Fig. 1), characterized in that it has a position fixing hole (8) which prevents the spring (5) from being pulled out by the elastic force (shrinkage force) of the heater (7).
[6" claim-type="Currently amended] 2. An integrated circuit socket (Fig. 1) according to claim 1, characterized by a fixing part (13) for protection and shape retention of the socket pin (4).

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同族专利:

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公开号 | 公开日

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KR100436259B1|2004-06-18|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2001-10-30|Application filed by 이영희

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2001-10-30|Priority to KR20010066948A

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2003-05-09|Publication of KR20030035075A

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2004-06-18|Application granted

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2004-06-18|Publication of KR100436259B1

优先权:

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申请号 | 申请日 | 专利标题

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KR20010066948A|KR100436259B1|2001-10-30|2001-10-30|Integrated circuit socket|